Electronics Forum | Thu Feb 18 20:24:37 EST 1999 | Tony
I'm trying to replace the PTH connectors with the SMT connectors in my design, and would like to make sure the SMT connector solder joints are as stong as PTH's. What's the right test to verify that? Is Pull and Shear test is the right choice? Where
Electronics Forum | Wed Oct 14 04:01:28 EDT 1998 | Joakim Fagerlund
We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to d
Electronics Forum | Wed Oct 03 17:08:32 EDT 2001 | davef
No comment or intent to appear critical on your particular situation, because you did the troubleshooting to determine the source of the problem, but �solder on the component lead, but not on the pad� is more often caused by a reflow profile that get
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Wed Nov 21 04:46:27 EST 2001 | emmanuel
Yes, i confirm you that the BGA i'm refering to are Motorola BGA. The fractures that appear after 500 thermal cycles (-45�C/+125�C) are located in the solder joint/pad connection. We have been asked if this fractures are due to BGA & PCB design or to
Electronics Forum | Fri Feb 01 14:23:47 EST 2002 | delnosa
Looking for help on getting information on understanding the physics of micro-fracture growth rate within the BGA ball (or solder joints in general). Hoping to find a fairly straight forward study on the concept/theory of this topic. I'm not a meta
Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
Electronics Forum | Fri Mar 28 21:37:11 EST 2003 | MA/NY DDave
Hi Are all the other solder joints for the other components other than the MELF not having a problem. That is what you said, yet I wanted to check?? To say a less twisted way is this only with the MELFs and is it with all the MELFs?? If you have
Electronics Forum | Fri Apr 04 17:43:52 EST 2003 | Kris
Hi, Did you use this paste before with out any problem or is it occuring for the first time ? If you wash only once a double sided board the side that passes through two reflow will have hardened flux which will may not be washed in your normal wa
Electronics Forum | Tue Apr 29 07:12:49 EDT 2003 | Glen barden
Sn/Cu/Ni is introducted to me in wavesoldering lead free process. Around in our industry, we have a plenty of info. about SAC but not on this alloy. The distributor showed me some information about this alloy including less dross, more shiny /smoot
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