Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
Electronics Forum | Tue May 25 10:16:03 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue May 25 10:16:07 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue Aug 03 16:52:41 EDT 2004 | Dreamsniper
Hi, What contributes to the above? I've got some BGA solder joints with a crystal like flux attached to it like a mini solder ball but do not have a perfect round shape. I had my aqueous cleaner's DI water sent for analysis and everything looks okay
Electronics Forum | Fri Aug 20 07:20:18 EDT 2004 | rlackey
Hi, We've got a 6622, been running since Jan & does a good job. You may want to consider the smart wave option as this will (allegedly)force solder up the holes to give you better joints for lead free. Spray fluxer works very well, limiting the am
Electronics Forum | Sat Mar 12 08:28:01 EST 2005 | Marcus
Fixing your problems needs to be based on hard data. But hard data is difficult to get from humans. They intend to see (and repair) what they e.g. understood best or what is easy to justify. This effect can be eliminated with an AOI. If programmed ri
Electronics Forum | Thu Mar 31 17:27:36 EST 2005 | russ
Are we possibly talking palladium instead of platinum? I haven't yet heard of platinum terminations (seems expensive) If it is palladium over nickel, I can tell you that you need to reach 225-230 Deg. C in reflow and the TAL should be about 90 sec.
Electronics Forum | Wed May 11 19:34:42 EDT 2005 | Tom B
You may want to check out Nihon Superior. Nihon licensed their Alloy to Aim for US production Late last month! The alloy uses nickel and the solder joints look amazing for "lead-free" they rival tin-lead in appearance. Other boasts is that you can
Electronics Forum | Sat May 28 04:56:23 EDT 2005 | WDLau
Dear, I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with: A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB Please kindly input, As far as I know the melting point of
Electronics Forum | Mon Jun 20 21:54:38 EDT 2005 | darby
Contact your paste supplier and see what they say. My information on SAC 305 FROM MY SUPPLIER was - "The cool down rate is not as critical for Pb-free solder joints, as it was for SnPb. The grain sizes do not differ is size in the Pb-free bulk solde
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