Electronics Forum | Fri Oct 10 05:04:26 EDT 2008 | bing007
We are using Mulicore MF101 flux and a Vitronics selective soldering machine on a lead-fee assembly and are having trouble with nozzles blocking even when the nozzle aperture is increased. Has anyone come across this problem before using fluxes with
Electronics Forum | Tue Jan 11 05:46:09 EST 2000 | Wolfgang Busko
Hi Dave, that was kind of a more rhetorical question. Normally paste is used before shelflife expires and delivery time is short enough to get in no trouble. The normal situation is that you try to get your equipment running means constant use of pas
Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam
Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V
Electronics Forum | Fri May 14 00:34:22 EDT 1999 | Mike D.
| I need some pics or documentation on how a finish soldered joint looks like for SMT component. I have various people who supposedly says has knowledge with High Temp says my joint could look better. The joint looks shiny and great except for a grai
Electronics Forum | Thu Oct 31 11:08:12 EST 2002 | soupatech
Being very new to SMT I won't assume I know what the problem is but.... I had lots of air pockets in solder joints, 95% of the boards. Everyone I spoke to thought it was a problem with my process but when one board was sent to our supplier they admi
Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto
I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel
Electronics Forum | Sat Nov 09 08:04:52 EST 2002 | erhard
if you wave solder you have to glue the SMD parts on the bottom side. If you reflow the bottom side then you usually shouln't go over the wave afterwards. It's quite logical the joints melt again, that's what you want to achieve going over the wave.
Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ
If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.
Electronics Forum | Wed Sep 21 01:57:40 EDT 2005 | hly
Hi K, Thanks for your reply. I was wondering if there is an industry spec that specifies a minimum required solder volume for BGA joints? Thanks HLY
Electronics Forum | Mon Mar 27 20:34:22 EST 2006 | ms
Thanks for the suggestion. The large ground pad appears as a single large pad on the component and PCB but we print a matrix of 28 small dots of paste to provide the solder for the joint. The inconsistent volume transfer can occur on any of the fo
