Electronics Forum: solder joint (Page 186 of 295)

0.5mm CSP reliability issue(Sorry that I can't use new thread)

Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang

It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board

Leaded and Lead Free BGA's on hte same board

Electronics Forum | Thu May 01 12:46:19 EDT 2008 | dphilbrick

Thanks for the link Samir. Although this thread does have some good info in it I don't think it is hitting the exact point I am trying to resolve. This seems to talk to a one profile fits all for running lead and lead free paste. I want to know about

Non RoHs Requirement

Electronics Forum | Tue Oct 07 16:19:34 EDT 2008 | mikesewell

If at all possible buy parts with 3% min. lead on the terminations. If this is not an option, "mitigate" whatever the finish is. Typically this means tinning with 63/37 all the exposed lead, not just the solder joint area. Several companies can d

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist

As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data

SAM vs XRAY

Electronics Forum | Tue Feb 09 23:40:19 EST 2010 | glennster

OK Sergey, looks like no one wants to take this on. I will give it a shot and maybe others will add their 2 cents. The answer depends on what you want to inspect. X-ray inspection is based on the X-ray absorption properties of the materials in th

inline AOI (whats the best!)

Electronics Forum | Thu Nov 03 16:47:52 EDT 2011 | hegemon

You need to define what it is you are inspecting for, and more importantly, what benefits you are trying to achieve with your acquisition of the technology? Inspecting post placement, post reflow, or both? Solder Joints? Through Holes? Part numbers

through hole questions

Electronics Forum | Fri Nov 21 11:00:27 EST 2014 | gregp

Hi J_Dub (Joe), Thanks for the input. Sounds like some fairly densely populated through hole assemblies. 100 solder joints per board is up to 50 parts per board (I know you may have DIP's so it could be less than 50). 24 boards in a panel x 50 par

Aluminium capacitor rotation after soldering

Electronics Forum | Wed Apr 22 08:40:18 EDT 2015 | markhoch

Hi Myriam, I think we may need some more information. Is the Electrolytic (Aluminum) Capacitor placed more than once per board? If so, are all locations twisting? This would typically be caused by a thermal imbalance that could be design induced. (u

Lead trimming

Electronics Forum | Fri Jul 29 13:30:43 EDT 2016 | gregp

Versatec specializes in the remanufacture of Contact Systems machines, most notably the CS-400E component locator with programmable cut and clinch. these machines are field proven over the past two decades and provide many benefits when utilized: 1.

Circuit cam and mydata

Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft

Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre


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