Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko
Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis
| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots
Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork
You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'
Electronics Forum | Sun May 27 04:18:22 EDT 2007 | grantp
Hi, We are currently soldering only connectors, so there is not that much to do. For the wave we currently use palettes as we solder PCI cards but don't want to wash. So the palette keeps the flux off the board. My reasons for looking at changing o
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Thu Sep 14 13:34:43 EDT 2000 | Boca
Of course the others have great answers, try NOT to do it, for all of their reasons. However, had to do it in the past, OEM, custom chip, die wouldn't fit in a SM package, volume wouldn't support a second package type ...... and on and on. So we us
Electronics Forum | Mon May 22 12:04:03 EDT 2000 | Michael Parker
80%. There are too many factors at hand to point the finger yet. We need to build a truth table and dot the i's and cross the t's before stepping up to Goliath (Samsung). Is you placement guranteed good? What x-ray have you used? Are your fab.'s know
winsouce.jpg)
.png)
