Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Fri Apr 23 14:14:49 EDT 1999 | Chrys Shea
| Hi everybody, | | I would like to bench mark the quality out of our wave soldering m/c as far as DPPM levels are concerned. Can somebody provide me with some figures at their site or anywhere else for the same. | | Thanks | Upinder | ====== | We
Electronics Forum | Fri Jun 19 13:40:25 EDT 1998 | Terry Burnette
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike There has been a
Electronics Forum | Wed Jan 22 14:53:50 EST 2003 | MA/NY DDave
Hi I thought I would come back to this one for a second. Joe Fox above gave a nice concise note as to why you must raise the temp high enough above the soldering melting temp (liquidus) yet not too high. You want to go high enough for paste so tha
Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller
Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.
Electronics Forum | Thu Jun 08 23:26:28 EDT 2006 | Shawn Vike
We are a small company, reletivly new to doing our own SMT (1 year) and we are having an issue, I think. We manufacture many board with no problems, but we have one that constently defeats us. This particular PCB has ENIG finish, and we have had th
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Sat Sep 26 17:58:33 EDT 1998 | Phillip Hunter
| O-H-H-H-H-H-H-H Lawdy, lawdy... | My babuh done left me... | my dawg pee'd on my leg... | my cornflakes are all poopy... | don't make me hafta beg... | I got's dem backplane blues, o-h-h-h-h-h lawdy..." | OH! | | Hi there! Scared me fer a secon
