Electronics Forum | Wed Nov 14 10:51:34 EST 2007 | mumtaz
Yes. Baking boards is best. Hitting the hamer on the head!
Electronics Forum | Tue Oct 21 10:25:05 EDT 2008 | hussman
They must live in a perfect world where they give you perfect boards and perfects parts.
Electronics Forum | Tue Oct 21 13:23:47 EDT 2008 | hussman
Don't tell them you repaired them.
Electronics Forum | Mon Jul 01 12:37:38 EDT 2013 | tpost
I do have access to an X-ray but it is only 2-D and it just appears as a black solder joint, not to impressive.. The main question though if it is a reowked solder joint does it still need to show wetting on the lead or can it be covered with solder
Electronics Forum | Mon Jan 26 11:46:16 EST 1998 | Rin Or
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Tue Oct 19 12:05:42 EDT 1999 | Wolfgang Busko
Hi Carol, does that happen also when you solder them with an iron ? That�s what I did with some joints using hightemp solderwire and couldn�t notice anything you mentioned. What Brian and Dave said should be worth considering. good luck Wolfgang
Electronics Forum | Thu Mar 01 11:43:08 EST 2001 | dason_c
Not enough info, when you say no clean flux, is it for wave soldering process, please provide more detail, SMT or wave, is it all the joint which you find the void? Rgds
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Tue Oct 19 10:53:14 EDT 1999 | Carol Zhang
Hi, I tried to use high temperature solder (540 - 570F)to connect four spacers on the board. The solder mask around the spacers wrinkled a lot.I can even see a few bulbs around it. I use hot plate and solder rings. After hot plate is heated to appr
Electronics Forum | Thu Nov 19 20:05:14 EST 2009 | davef
Density. There is a difference between lead (.410 lbs. per cubic inch) and tin (.254 lbs. per cubic inch). The same volume of tin-based solder, therefore, weighs approximately 1/4 less than a lead-based material. This adds up to more joints per pound
