Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd
How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so
Electronics Forum | Tue Mar 15 09:46:06 EST 2005 | davef
Comments are: * J-STD-001 and A-610 committees have eliminated the requirement that solder joints be "bright and shiny". Certain metallizations (such as gold) can influence the solder joint surface texture, but have no impact of reliability. Reliance
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Tue Jan 30 09:26:59 EST 2007 | CK Flip
I think most people don't "get" soldering, and advocate the "more-is-better" approach as if solder were duct tape - you know...the more duct tape you put on something the stronger the bond. Such is NOT the case with soldering. People don't "get" that
Electronics Forum | Wed Dec 29 15:42:34 EST 1999 | Mike Naddra
Justin, I would be currious as to your customers application, and if the temperature delta and rate are great enough to cause solder joint failures as a function of mismatched Tce then you may want to consider that even if you are able to identify
Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Thu May 26 21:16:54 EDT 2005 | thaqalain
A solder connection that is characterized by the presence of solder beyond the connection area is called: *Excessive solder *Insufficient solder *Open Solder Joint
Electronics Forum | Mon Nov 25 18:43:29 EST 2013 | hegemon
Without the proper tools in house you will not be able to determine anything but the most obvious problems. At minimum, some side looking microscope that would allow visual inspection of a row or two, and to be able to rule out bridging. Using that
