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Electronics Forum | Mon Jun 13 10:28:29 EDT 2005 | andymackie
I've had a lot of experience with solder spatter. It's usually related to moisture (humidity) uptake by the paste, or outgassing from plating: particularly Au/Ni. Solder spatter from the plating will change from board-vendor to board-vendor. I shoul
Electronics Forum | Wed Mar 15 00:44:39 EST 2006 | vicknesh28
Would i be able to judge how good is a reflow profile from the appearance of the flux residue? Often times i come across flux (not sure if residual) between a non-wet QFP lead and the reflowed solder paste on the pad (it's sandwiched between the bott
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Wed Apr 13 10:05:58 EDT 2016 | donnie15
I am working on soldering an Large LGA module to a PCB and am having some issues with opens due to variation in the board flatness. I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. I have tried adding sol
Electronics Forum | Thu Feb 09 20:12:51 EST 2017 | imarkl
Any advise about dewetting defect occurrence during 2nd pass reflow. Commonality on affected PCB having water marks near affected pad(s). Elemental composition found on affected pads without solder paste are Silicon and Sulfur. As well as in pad with
Electronics Forum | Sat May 18 07:36:31 EDT 2002 | davef
Copper teminations with no solderability protection on your LLP. Hmmm seems unusual, but it could be that the flux in your solder paste is not active enough to remove the corrosion on the Cu leads. OMG Microbond solder paste develops white residue
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Sun Oct 11 13:53:26 EDT 1998 | Vincenzo Longobardo
I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. Is there a technical d
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