Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com
I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
Electronics Forum | Tue Oct 16 08:09:39 EDT 2007 | davef
In the fine SMTnet Archives, grantp gave the following response to a similar question: KIC supplies a free-downloadable software that "takes your profile data and recommends the best oven temperature settings and conveyer speed for your oven. The so
Electronics Forum | Thu Dec 20 10:15:09 EST 2007 | slthomas
Wow, Chunks, condescension becomes you. Not. I think that in this forum when someone mentions *stencil* printing and doesn't specify what material, we tend to gravitate towards a scenario that involves printing solder paste first, then adhesive. If
Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti
Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou
Electronics Forum | Wed Apr 09 17:39:30 EDT 2008 | diesel_1t
Hi. I know that this is one of the mos common threads here, I have been doing some research, but i didn't find any similar. The main issue is that I have seen tombstoning since two weeks ago, it is more characteristic on 0603 resistors (Stackpole e
Electronics Forum | Thu Jul 24 21:20:58 EDT 2008 | srt
Hi, Now we also facing voiding issue after rework .But this only happen to 1 BGA from diffrent PCBA.We also already change 3 type solder paste and fine tune the profile follow solder paste spec but problem intermitten happen again.Pls help to advic
Electronics Forum | Wed Oct 01 19:23:52 EDT 2008 | paligora
It depends on the usage , if it is regular and steady, only order when needed , we only order 2 jars when the last one is taken out of the fridge.One jar would last us about 2-3 weeks and it stays on room temperature. Ofcourse , you need a realiable
Electronics Forum | Mon Aug 24 10:35:54 EDT 2009 | rossi
I don't think its an issue with the PCB. When we just put the paste down and not the BGA the solder paste seems to adhere to the PCB pads very well (not brittle). Also we have other very similar PCBs that we run different normal silver content BGAs
Electronics Forum | Mon Nov 16 10:50:50 EST 2009 | ppcbs
I agree customer is being overly stringent, and that their is a possibility that BGA's have voids prior to installation. If you determine that the BGA's do not have voids prior to installation I suggest you slow down your ramp speed to allow the flu
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