Electronics Forum | Tue Oct 03 15:28:24 EDT 2006 | realchunks
No adhesive? Then how about 2 different solder pastes? Higher melting temp for the first side, lower for the second.
Electronics Forum | Wed Nov 29 01:20:44 EST 2006 | fastek
Guess- If a component drops at the camera the machine will not proceed to attempt to place it and drive the nozzle into a brick of solder paste. The line sensor will catch the fact there is no component on the nozzle and will retry to pick and place.
Electronics Forum | Thu Dec 07 08:50:24 EST 2006 | Mario Scalzo
Here is another article. http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Articles⊂section=Display&ARTICLE_ID=229920 Thanks.
Electronics Forum | Tue Jan 09 08:00:29 EST 2007 | pavel_murtishev
Good afternoon, 22C +/-2C, 40%RH +/- 5% is a good starting point. I wonder if any standard requires floor temperature and humidity control. Most of requiremens come from solder paste manufacturers. BR, Pavel.
Electronics Forum | Thu Jan 18 12:07:52 EST 2007 | tonang
How to problem solved about production reject IC short? Please advice us about setting screen mask printer, stering solder paste, profile reflow etc Thank you for your attention and cooperation Best regard, Tonang
Electronics Forum | Fri Jan 19 08:52:31 EST 2007 | pavel_murtishev
Good afternoon, DEK�s Pump Print is used for solder paste printing as well. Send your design to DEK and they will design the Pump Print stencil for your needs. Please note that price for pump print stencils is five times higher compared with convent
Electronics Forum | Mon Jan 22 03:51:16 EST 2007 | Bing
We are using HASL board for Press Fit, without problem in the past until recently. Now we are seeing the solder in the PTH melt and block partially the PTH hole during the reflow. It gives problem when Press Fit. Anyone has advice on this?
Electronics Forum | Mon Feb 05 21:56:31 EST 2007 | ViVian
what type of solder paste I should use if Rohs and non rohs component mount on same board
Electronics Forum | Wed Feb 28 15:09:57 EST 2007 | Hussman
Some no-cleans will pool flux on the top of the solder joint which acts like an insulator. I normally do not paste "contact" pads. You can have your board house HASL them if you need the extra bump on the pad.
Electronics Forum | Thu Mar 01 16:03:50 EST 2007 | Brandon
Who removes your HAZMAT bucket waste? We need that too. Yeah it is scraped off the stencil and dryed up. Who removes your dross?
Capital Equipment Solutions - SMT | PCBA | TEST
Equipment Dealer / Broker / Auctions
113 S Main Street
Lodi, WI USA
Phone: 6083431779
.gif)
