Electronics Forum | Fri Jul 16 06:22:31 EDT 1999 | Wayne Sanita
Mark, I had the same peoblem. For my stencils i use a 15% reduction for the width of fine pitch leads only, as Earl said follow the 1:1.5 standard. We consider pitches of 32mil and under. We also clean the stencil every other board to ensure no caki
Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon
| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Mon Apr 05 14:25:56 EDT 2010 | krish_bala
Hello Bob, What makes this problem even harder for us is that we are not the manufacturer of this particular board. We are just performing re-works on them based on the issues they come in for, and thus refurbishing the unit. We are currently in th
Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus
| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel
Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir
Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL
With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
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