Electronics Forum: solder paste inspection (Page 711 of 749)

Re: Re balling BGA

Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach

| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |

No Free Beer But...

Electronics Forum | Fri Oct 16 07:33:01 EDT 1998 | smd

| | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | Q: Can you get away w

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Immersion Ag

Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef

We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition

Re: Is it possible to rework this BGA socket?

Electronics Forum | Wed Jan 06 23:49:48 EST 1999 | Chris G.

| Hey All you Einsteins out there!! | | I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring two prototype boards over to rework a BGA socket

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 16:55:50 EST 1999 | Chrys

| | | Hello, | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | So far, the tests I can think of performin

Re: Who Are The X-Men?

Electronics Forum | Thu Oct 15 14:33:37 EDT 1998 | Earl Moon

| | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | Q: Can you get away with spending

Re: Who Are The X-Men?

Electronics Forum | Thu Oct 15 17:20:25 EDT 1998 | Justin Medernach

| | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | Q: Can you get away with sp

Re: Tin-Lead thickness on PWB's

Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F

| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol


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