Electronics Forum: solder paste printing (Page 216 of 802)

Through-hole/SM mix

Electronics Forum | Mon Oct 15 10:57:32 EDT 2001 | davef

Before this wave solder pallet salesman blather gets too far out-of-control, let�s stop for a minute. The three major approaches you have are: 1 SELECTIVE SOLDERING: Using: * Specialty wave soldering machine to solder specific areas of a board * P

Re: Mid Chip Solder Balls

Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson

As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur

Solder Wetting

Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold

We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per

Re: Polyimide See Thru Stencils for Printing Solder Paste

Electronics Forum | Thu Jun 25 09:13:25 EDT 1998 | Brad Stapley

| Has anyone seen/used these yet? They seem to have lower coefficient of friction for release of paste and less wear and tear as well as conforming to the board better (plastic has better memory than stainless). Also there is no mesh so a larger ima

Re: Polyimide See Thru Stencils for Printing Solder Paste

Electronics Forum | Mon Jul 13 11:38:16 EDT 1998 | Steve Gregory

Zulfiqar, The company that makes these stencils is a Canadian company named KJ Marketing (I'll paste a link to the web site in this message). It sounds pretty interesting. I've communicated with a few people that have used these stencils and the

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

Question about pad pullbacks

Electronics Forum | Mon Dec 18 13:00:34 EST 2006 | realchunks

Hi John, Depending on your board, it could make a difference. Copper finishes might leave that part of the pad exposed, which is a no-no in most places. Where as a HASL board prolly won't care if you pulled the print back. On the other end, over

Possible to temporarily store mounted but not soldered PCB's?

Electronics Forum | Wed Sep 05 08:50:04 EDT 2001 | davef

No arument with others comments about moisture, but taking a different tact, consider that the volitle elements of the solder paste disppear as a function of the amount of time the paste is out of the container. [Maybe as a function of solder paste

Reflow soldering through hole parts

Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc

Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch

Solder Balls at component side around Pin in Paste components

Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus

Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering


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