Electronics Forum: solder paste printing (Page 371 of 800)

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Wed Jan 04 15:10:27 EST 2006 | grantp

Hi, That's the main problem. I quickly checked out the motorola document, and thanks for posting that, but the main reason for failure seems to be that the ball is not touching the solder pad. I wonder what kind of ball size tolerance they had on th

No-Clean or water

Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin

No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than

problem in solderability

Electronics Forum | Thu Aug 28 07:32:06 EDT 2008 | realchunks

I've been there. Soldering no lead parts in a leaded world can be difficult. Sounds like you are not wetting to your parts becasue you ar enot getting hot enough. Here's the trick - you can turn up your profile to look like a no-lead profile, and

Solder Balls-No Clean Paste

Electronics Forum | Thu Aug 19 05:19:31 EDT 2010 | grahamcooper22

I have seen that moisture in pcbs will cause mid chip solder balls. To discount this, take one pcb from a batch that is giving you solder balls and pass it through you reflow oven with no paste or components on (bare pcb)using your normal reflow prof

63/37 HASL Finish / RoHS Solder Paste

Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs

What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ

Re: OSP surface finish.

Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko

Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste

Stencil Printing for MPM model # SPM

Electronics Forum | Sat Mar 17 15:12:33 EST 2001 | robhal

First thing to check is that you have a good gasket between the PCB and the stencil (if not check that the tactile is free of paste at the base of it and calibrate the tactile. I am assuming it is not a head mounted tactile) Also check that the wipe

Re: Paste Push-Out In PP Assembly

Electronics Forum | Thu Jul 20 12:59:52 EDT 2000 | Mike McMonagle

Bob, I attended your PIHR workshop at Nepcon a few years back. At the risk of making a shameless plug, I must say that the presentation and the materials used were some of the best I have seen in my many (20+) years in the industry. The video that is

Stencil cleanliness and inspection

Electronics Forum | Tue Jun 05 14:38:55 EDT 2001 | pteerink

You would be better served to check your print quality as you run. Any problems caused by dirty stencils ( plugged aps etc ) would show up right away as a defect. Search the forum for more on this subject. I seem to recall the same subject coming up

3D Vision vs 2D vision

Electronics Forum | Thu Jul 19 09:56:52 EDT 2001 | Damian Holzmann

The obvious difference between 2D and 3D is that an accurate volumetric measurement can only be obtained with a 3D measuring system. Laser line measurement in 2D does not allow accurate volumetric measurement. If you modify the aperture in a stencil


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