Electronics Forum: solder paste printing (Page 471 of 802)

Immersion Silver Issues

Electronics Forum | Wed Aug 09 08:46:01 EDT 2017 | stivais

I agree. Just thinking.. could it be copper plating issue as well? anyway, would be interesting to see some photos. Sounds like solder (from HASL process, wave or even poorly washed SMT solder paste) to me.

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Fri Jun 21 03:07:28 EDT 2019 | gregoryyork

REL alloys from Aim solders maybe worth looking into for this application. May I ask what your profile on reflow is like please, especially peak

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Mon Jun 24 22:15:56 EDT 2019 | sssamw

Can you please tell us which components cracked? Component type, size, pitch, pin Qty, etc. The solder cracked in thermal cycling is very complicated and difficult to solve.

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Wed Feb 14 04:48:58 EST 2018 | ameenullakhan

The profile I have shared is for SMQ92J leaded solder paste

Soldered lead length measurement & IPC compliance

Electronics Forum | Wed Aug 08 14:57:20 EDT 2018 | tey422

If you happen to have the Solder Paste Height Measurement System, it would able to do the works for you. That's only if the leads are not long.

Reflow soldering issue

Electronics Forum | Fri Aug 24 12:59:03 EDT 2018 | cupet

Dear davef, but this LED is skip component, that's a blank footprint and one of its pad is badly wetted...this is the reason for my thinking about contamination. Do you mean different solder paste with more aggressive flux?

Soldering Issue in Sensor component

Electronics Forum | Fri Dec 27 14:22:00 EST 2019 | ameenullakhan

Hi , Thanks..., Its "not wetting the pads sufficiently" We have tried with RTS , Our paste is ROL0 based chemistry. Which solder have you changed. Regards, Ameen

LGA voiding

Electronics Forum | Fri Jan 03 02:03:58 EST 2020 | sssamw

What's your target for voiding? I cannot see it violate 25% of solder joint area. Process setting and PCB design can impact the voiding, many factors, such as PCB pad, stencil aperture and thickness, re-flow profile, solder paste, etc.

HIP defect in BGA

Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw

I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?

Part drop after reflow

Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu

Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?


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