Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies
| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com
Electronics Forum | Wed Aug 25 09:48:28 EDT 1999 | Larry Koens
| | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | Any help would be appreciated. Thanks. | | | | | Most common reason is uneven heating where one side
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Tue Nov 18 15:03:39 EST 2003 | Mark
Yup. I'm attempting a small, but very important experiment. I need to solder several Lead-Free Globtop BGA parts to a Pin-Socket interposer assembly. I'm trying to come up with the best way to do this. I'm thinking of using lead-free solder paste, (b
Electronics Forum | Fri Mar 04 18:28:21 EST 2011 | hegemon
First, I would inspect for lack of solder bridges from the center slug to the outside leads. I would then look for evidence that the solder paste has reflowed beneath the component, without leaving too much void percentage. Typically we allow up
Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter
Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and
Electronics Forum | Tue Jan 05 19:25:50 EST 1999 | Earl Moon
| Jan 05, 1999 | | My question is: | Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? | | Thanks for your respond. | El
Electronics Forum | Wed Mar 18 22:53:53 EST 1998 | Scott McKee
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Mon Jul 05 03:53:36 EDT 2004 | johnwnz
Hey, this is something that I've looked at and published a paper on back in 2003 at Apex, actually pert of one, the other part was lookign at how effective X-ray systems (lamanography systems) were at detecting & measuring BGA void size accuratly (co
