Electronics Forum: solder paste printing (Page 486 of 802)

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Selective soldering pallets

Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton

Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T

QFP Defect

Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie

Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t

Affordable Inspection Microscopes?

Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson

I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef

ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 11:39:56 EST 2001 | Steve Thomas

On a related note, I'm wondering if any of the newer devices have any way to factor in paste not releasing from the corners, or for that matter, radiused, oval, or round apertures. We have an LSMII, and all it does it let you draw a rectangle around

PASTE LEACHING

Electronics Forum | Wed May 03 13:06:54 EDT 2000 | Sal

GUYS SEEING A PROBLEM WITH SOLDER PASTE LEACHING. THE PCB IS HASL FINISH , AND THE DEVICE IN QUESTION IS A O.O30" PITCH RESNET. THE SIZE OF THE PADS ARE 0.020 x 0.0.047 THOU , THE APERTURE SIZES ARE 0.018 x 0.042 THOU . THE LEACHING IS OCCURING DUE

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: 0402 Components and Solder Paste

Electronics Forum | Thu Jul 20 14:57:26 EDT 2000 | Bob Willis

I have just measured my new test board and the dimensions are 0.025� square, 0.015� seperation with resist aperture 0.004� larger. Don�t know when I will be using it yet. I have not seen a head to head with these pastes yet, I know that Panasonic ar


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