Electronics Forum | Wed Oct 07 15:15:04 EDT 1998 | Joe P.
| I am currently experimenting with Pin-To-Paste reflow. does anyone know some excellent references or links that could give me tips and tricks, optimal aperature dimensions, etc. I have been informed that if I have pull through that I should put a
Electronics Forum | Thu Mar 17 09:53:20 EDT 2011 | rperkins
Hi Graham, I've worked in the industry selling EnSolv, Lenium, and now ENTRON solvents, which are all based on stabilized NPB. These solvents do not always clean the no lead pastes. The problem is that the pastes are becoming more like adhesives,
Electronics Forum | Sun Sep 02 09:06:42 EDT 2018 | davef
Cold resistance between the tip of the tool and the ground reference, tip current leakage, and tip voltage. per ANSI ESD STM 13.1 J-STD-001 Rev G, Appendix “A” Guidelines for Soldering Tools and Equipment: A-2 BENCHTOP AND HAND SOLDERING SYSTEMS Se
Electronics Forum | Mon Apr 12 19:22:54 EDT 2004 | russ
So if I get this right, your customer wants you to run this product as pb free even though it is not. In order to run this as pb free you need to run pb free paste. If you use 63/37 paste at the higher temps I believe that in addition to the compon
Electronics Forum | Tue Apr 13 15:44:41 EDT 2004 | Dreamsniper
Hi Guys, Thanks for all your informative replies. I do know that Motorola is using a No Clean Eutectic Solder for their BGA's. We are in Aerospace and is using a Water Soluble Paste Flux. Now, a) Can anyone explain to me about the effect of thei
Electronics Forum | Mon Dec 17 16:04:24 EST 2007 | ck_the_flip
Another tactic. Become friends with all the local solder paste reps, get them to buy you lunch, etc...but the key is...get them to give you free samples. That way you wouldn't have to BUY any paste. As for the original fella, sounds like he's on a
Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven
| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s
Electronics Forum | Fri May 29 14:35:05 EDT 1998 | Steve Gregory
| We are getting solder balls after reflow of surface mount components. We are using a no-clean paste and a new jar seemed to help for a little bit. Any ideas? Thanks in advance Hello Ryan, There's a quite a few things that can cause solder bal
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
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