Electronics Forum | Thu Mar 04 14:20:41 EST 2004 | Robert
Another question... I use 500gm jars of Kester 256. After a job is complete the used solder is collected and put back into the jar. Generally while a job is run, the jar and used paste could be left out/open for up to 4 hours. A piece of seran wrap i
Electronics Forum | Fri Jun 11 13:20:32 EDT 2004 | raylawre
We have segregation of materials, Different storage areas for paste and Bar stock, etc. We are bar coding the solder paste materials (have to scan paste container, and blades before use, etc. line won't run unless its good). Also changed packaging s
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Wed Feb 09 22:08:45 EST 2000 | Dave F
Russ: You've got stop soft-peddling this stuff. This doesn't sound like "poor solderability." It sounds like "no solderability." It also sounds like you�re dead meat. Three places to call: 1 Board supplier to get their suggestions on unsolderab
Electronics Forum | Fri Dec 22 09:39:22 EST 2000 | CAL
Some random Ideas when I read you post...... 1) If it works don't fix it. 2) Be aware of the temp threshold of your components....Over heating components is not good. Over heating is not good period. 3) The Solder paste Chemistry you are using maybe
Electronics Forum | Sat Nov 25 18:45:19 EST 2000 | Ashok Dhawan
I am getting black spots / stuff while I run gold finish PCB through reflow soldering process using NC solder paste.The affected spots have intermetalic as black in color. Does not solder very well. I did look at the archieve but could not find info
Electronics Forum | Fri Dec 17 16:07:07 EST 1999 | Alex B
Hi, C.K. Let's assume that your stencil's thickness is in a range 4-6 mil or by other words the height of the solder paste on a pads is the same (close enough to reality) Therefore, for pad's width more than 20 mils(as well as pitch between pads) th
Electronics Forum | Wed Jun 05 15:09:44 EDT 2002 | cyber_wolf
I have seen this happen before it has been my experience that even one tiny sphere of solder form your solder paste will melt and spread out on your gold fingers. The particles are so small that they are not visible to the naked eye. If operators ha
Electronics Forum | Wed Dec 14 07:38:56 EST 2005 | tk380514
the original question was: Please give me some guidelines on designing Stencils for Fine Pitch. which i did however, 40% fallout for solder shorts this could be caused by many other processes having gone wrong before, i.e. type of solder paste
Electronics Forum | Sat Dec 17 11:45:40 EST 2005 | DAM
You know, many SMD components have copper alloy leads and then a copper (or Ni) barrier on them. On the copper (or Ni) barrier there is the finish. Usually the finish is made of Sn\Pb (tin-lead), and if I solder with a Sn\Pb solder paste it's all rig
