Electronics Forum | Thu Jul 20 14:02:28 EDT 2000 | Deon Nungaray
Hi Bob, I know that that conductive adhesives have been considered as a lead relacement in the past, but have been ruled out due to cost and other process issues (surface tension etc..) IBM has extensive development data on the topic and had come up
Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
Electronics Forum | Tue Feb 01 21:53:06 EST 2000 | Dave F
Emmanuel: You have choices to prevent the solder paste from flowing to the second side during reflow: 1 Have your board fabricator plug the vias. 2 Put a temporary solder mask on the secondary side vias. 3 Have your designer relay-out the vias unde
Electronics Forum | Tue Dec 28 12:26:22 EST 1999 | Christopher Lampron
Rick, Does the ultrasonic cleaning system that you use reuse the same water for each cleaning cycle? I have had a similar problem in the past using a Brandson ultrasonic cleaner and water soluable flux. The problem was the buildup of flux in the clea
Electronics Forum | Fri Dec 17 06:11:33 EST 1999 | Christopher Lampron
Henry, TNT makes some good points. I have also found that the use of a 2% silver solder paste (provided that it's allowable) can help reduce the occurance. You may want to run a thermal profile on the PCB is question. Is the board thermaly equalized
Electronics Forum | Thu Dec 09 17:18:44 EST 1999 | Russ
Ron, I'll bet you have the Ni/Pd finsh on these components! We have had the same problem in our shop. Not knowing the Kester spec. we had to raise the max temp to 220 Deg. C and increase the time above liquidous to 60 seconds or greater. It seem
Electronics Forum | Wed Oct 17 19:01:34 EDT 2001 | scott
We have a local shop here in S-Cal. called MaskTek that invented a solder deposition process that eliminates the need for solderpaste but you still need to use "sticky" flux. They license the process to various facilities around the country. Was pr
Electronics Forum | Tue Oct 05 10:48:46 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's u
Electronics Forum | Tue Oct 05 10:13:48 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clea
Electronics Forum | Fri Jul 16 22:44:27 EDT 1999 | Vic Lau
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
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