Electronics Forum | Thu Oct 16 00:08:31 EDT 2003 | Dean
Why would you have troubles if and when you switch? Isn't that the point of materials evaluation? Understanding the impact and material capability BEFORE "betting the farm on it". I would never stake my career on a solder paste without an Engineer
Electronics Forum | Wed Nov 12 15:48:36 EST 2003 | johnwnz
Thanks for the info Dave, the link provides very interesting reading! btw, JohnW and JohnWnz are one and the same, I've moved down to Sunny New Zealand to ply my trade / skills down here and have soem fun in the sun while I'm at it. A move I'd total
Electronics Forum | Thu Jan 15 10:08:54 EST 2004 | ADAM
Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder
Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny
I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel
Electronics Forum | Mon Jan 26 11:10:56 EST 2004 | samaniegocesar
Hello to all of you, I'm running some small pcb's about 2.5x3.5 inches, can somebody tell me the zone temps and speed in meters/min that I have to use to get the best solder paste shine and best quality, is an oven of 8 zones. I apreciate your suppor
Electronics Forum | Wed Mar 17 17:30:53 EST 2004 | johnthor
hello Dreamsniper I'm assuming that you want an inexpensive yet accurate instrument to periodically verify your process/machines. A focussing microscope with a small depth of field is quite useful. You simply focus on the board, then refocus on the
Electronics Forum | Wed Apr 14 07:59:54 EDT 2004 | arcandspark
Makes a lot of sense, thanks for the excellent input. The peak temp I am running fo our pb free (238C and approx. 90 seconds above 183 C)is the recommended profile from T.I and also the solder paste manufacture. Not sure exactly what the melting temp
Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron
Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m
Electronics Forum | Mon Jun 07 21:26:03 EDT 2004 | davef
First, voiding is a process indicator. Next, as you say, the profile is a significant contributor to void formation. Finally, when considering the "material factors" that drive void formation, solder paste formulation is the most critical. Discuss
Electronics Forum | Fri Jun 18 13:20:42 EDT 2004 | jdumont
Thanks a lot. Actually, you are our local rep for AIM. Do you offer any services such as coming down to RI to set up a profile or anything of that nature? We currently use AIM 256 and the wetting isnt as good as I would like to see. Thanks JD
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