Electronics Forum | Wed Feb 18 12:18:28 EST 2004 | babe
Sometimes this is related to oxidized paste or paste that has sat onthe board too long before reflow. However most likely this is related to your reflow process. either too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly wi
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Tue Feb 21 01:32:49 EST 2017 | soldertraining
Looking for advice on soldering lead free paste to a board with very heavy gold plating, In my opinion, Gold contact surfaces are often used on circuit boards with membrane switches which is a choice of technology for industrial, commercial and consu
Electronics Forum | Tue Mar 17 13:11:58 EST 1998 | ETS, LLC
ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I
Electronics Forum | Wed Nov 21 12:29:52 EST 2001 | mparker
Now that we know where you've been and what you wish to accomplish next, I can still give you some suggestions. 1. Get IPC-7912. Use it to evaluate your CM's. Especially if you have multiple contractors supplying like products. You will quickly see
Electronics Forum | Fri Nov 30 18:22:40 EST 2007 | mika
Hi Paul M, There are no silly questions but silly answers.. and here is maybe a few if I understand you correctly: If you consider place anything less than a 1.27mm (50mil) pitch component down or a chip less than a 1210, hey it maybe don't even work
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Wed Jan 08 16:27:11 EST 2020 | rmitchell
We have a PCB with the dual sided connector that slides on from the edge and has leads on the top and bottom sides of the PCB. It has 20 leads on each side of the PCB with with about .8mm pitch. The PCB also has a gold grounding strip on the edge fo
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
