Electronics Forum | Sat Apr 21 14:50:17 EDT 2012 | edmentzer
We are using SN100C in both our wave and selective machines and have very good results. We also using it for ROHS hand soldering. It flows better than SAC305, the joints are shinny just like Sn63/37. We are looking into using SN100C as our paste b
Electronics Forum | Mon Jan 21 17:59:11 EST 2013 | jorge_quijano
I had a similar situation with a very thick PCB (0.23") I could not get a TAL lower than 160 sec, I've spoken with my paste supplier about this issue and we have made some adjustments on the oven and we could lower it to 145 sec, I know it is higher
Electronics Forum | Tue Mar 19 13:32:21 EDT 2013 | rgduval
In the past, I've used kapton tape for masking, as well as masking tape and solder mask as you've described. I've also used dummy connectors, or connector caps to cover connectors/pins. In the end, though, I'm not sure any of these methods decrea
Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum
So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the
Electronics Forum | Thu Apr 21 20:09:18 EDT 2016 | adamjs
I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. You do need the thicker stencil. To prevent the shorts, you need to have your pick-and-place machine probe the exact height of the board (at multiple loca
Electronics Forum | Mon Nov 13 09:40:01 EST 2017 | philc
Just a few thoughts, as we use similar quite frequently without issues. Ensure correct support when pasting the board, especially if it is thin. Correct support when placing the part. Is it placed correctly by the machine? If it is very slightly of
Electronics Forum | Wed Feb 13 09:30:32 EST 2019 | SMTA-Joe
*UPDATE* I decided to modify the experiment slightly by forgoing my attempt to achieve reflow with the component. Instead I applied SN42 paste directly to the pad and attempted reflow of the paste by itself. The end result is as follows: Hotplate
Electronics Forum | Thu Dec 17 15:53:32 EST 2020 | dwl
for option 3, if you place the connectors on the first pass then flip the board, won't the protruding leads interfere with second pass stencil printing? My vote would be to overprint onto the solder mask. you can print pretty far and still have it w
Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr
| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly
.gif)
