Electronics Forum | Sun Nov 28 03:27:03 EST 2004 | jmedernach
Hi Guy, I see them frequently. Usually, if I have voids on my BGA's, I'll have them on my passives as well as at leaded device solder joints. They run rampant through the entire assembly. For me, it's a function of my profile. I only have a 4 zon
Electronics Forum | Fri Apr 01 11:04:35 EST 2005 | chunks
A company called BEST makes a thing called Stencil Quik. It's like a stencil that sticks onto your board, you squeegee paste, place component/board and reflow. The Stencil Quik remains on the board. It prevents shorts and in your case could provid
Electronics Forum | Wed Apr 27 10:47:26 EDT 2005 | HOSS
A 1:1 pad to ball diameter will cause the balls to collapse more giving you less post solder component standoff. Depending on the application of this product and required reliability, you may want to stay with the padstack being used. You may try c
Electronics Forum | Thu Jul 14 19:12:40 EDT 2005 | sync40
Hi. In the past years I had made dozens of PCBs but now I am trying to get a professional finishing on them. The main problem is oxidation of the copper traces. Basically I use the silkscreen method to make the pattern in both layers and then etch. L
Electronics Forum | Tue Sep 20 23:12:38 EDT 2005 | darby
Several suggestions. Your hands may be tied but here goes. 1. Doctor your stencil so that pads are not shared etc and reduce the apertures more that what you would normally. This may stop one pad wetting into another etc. 2. The use of a Pb-free sol
Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu
We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe
Electronics Forum | Thu Dec 15 16:31:45 EST 2005 | Samir Nagaheenanajar
The general consensus is - you can run Pb-Free/RoHS parts in a Sn-Pb process as long as you RUN HOTTER. I've heard that "running hotter" means greater peak temperatures exceeding 217 / 221 C - common SAC alloy eutectic points. Anybody know any gene
Electronics Forum | Wed Jan 04 13:59:14 EST 2006 | chunks
Ask your customer why they need this? Show them your process. Then bury them in their own unknowledgeable requests. It is pretty scary how many papers are also written about how easy it is to reflow a lead-free BGA with regular leaded paste. ht
Electronics Forum | Fri Feb 10 10:56:12 EST 2006 | jax
Has anyone out there actually used this product? We have put in multiple requests for Quotes, samples, and Purchases over the past month with no response. All attempts at contacting the sales group have failed. Currently we are being told that only
Electronics Forum | Thu Apr 20 07:53:24 EDT 2006 | Yanick
Hi, I'm just wondering if someone have more information about board with immersion tin plating. I search in the archive but didn't find anything interesting. We try it, and we have difficulties to make a good solder joint with the wave. And wi
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