Electronics Forum | Fri Dec 16 08:11:39 EST 2005 | rlackey
Hi Dave, Sorry, blonde moment. For our prototype line we decant the paste into a cleaned out pot, that goes under the printer hood, with the lid left on, the rest stays in the fridge until it starts to run down. If we get it wrong we definitely
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach
Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So
Electronics Forum | Thu Apr 16 09:33:12 EDT 1998 | Philippe
Is there anybody to help me ? We have small balls appearing on the boards soldered by wave soldering machine and it looks that use of nitrogen is linked to the problem (because without nitrogen, we have no more problems). That remind you something ?
Electronics Forum | Thu Apr 20 02:44:39 EDT 2017 | tsvetan
The hole is too big, you should reduce the size in the next PCB revision. The middle joint is soldered at low temperature you can see how the solder didn't distributed evently and cooled on waves. The solder joint at the bottom didn't wet the capac
Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Fri Apr 10 14:10:13 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Fri Apr 10 14:08:51 EDT 1998 | Jim Hoxie
We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f
Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F
Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
