Electronics Forum | Mon Feb 23 13:25:21 EST 1998 | Steve Gregory
Steve - you must not work to IPC class 2 or 3 requirements. If the solder is "pillowed" around the lead, I would strongly suspect a wetting problem. Most of the Paladium leads I see soldered have a strong line of demarcation but no pillowing. Hav
Electronics Forum | Wed Jul 13 14:56:53 EDT 2005 | jdengler
I read the Cookson/Alpha paper "Optimizing stencil design for Lead-free SMT processing". I interpreted it to mean that if you had a mid chip solder ball (MCSB) problem the "radiused inverted home plate of 20/60/20 style" had the greatest impact on r
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Tue Sep 09 07:03:56 EDT 2008 | mun4o
Hi All, we poduce diferent kind of Keyboards, and use a lot of SMT LEDs.When I looking for reflow soldering Conditions i n the Data Sheets, usually I find "IR-reflow" Soldering profile.Our Reflow owen have onli conventional heating.Is that problem?
Electronics Forum | Mon Oct 22 10:51:48 EDT 2007 | davef
You say, "we have encountered solder wicking on components ..." We expect to see wicking on solder connections. Maybe we're just using different terminology. Please describe the problem that you're seeing.
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Wed Apr 28 13:53:00 EDT 1999 | Tony Arteaga
Anyone using hot air nife for wave soldering process. Does it work? Does it really eliminate solder bridging and does it create any other problems? any feed back will be much appriciated. Thanks Tony A
Electronics Forum | Wed Jan 22 14:14:56 EST 2003 | Stephen
Most of the design considerations will be for the wave soldering of the SMT parts. Have you considered selective soldering pallets or masking as an alternative? One problem I have seen with the epoxy process is parts that are high off the board and t
Electronics Forum | Wed May 09 11:01:27 EDT 2007 | callckq
Yes, continue to use SAC solder. However, as far as I know, the problem become more severe when cooling rate is increased.
Electronics Forum | Mon Jun 04 09:15:08 EDT 2012 | davef
bwjm: Delamination can be attributed to several factors: * Entrapped moisture, processing solutions, and what not that expands when heated to normal soldering temperature * Excessive soldering temperature * Excessive laminating temperature * Def
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