Electronics Forum | Tue Jan 16 03:05:32 EST 2007 | aj
All, The component that seems to be effected most is a : NemeriX NJ1006A QFN type device. If heat isthe problem what exactly is happening to the part -cold spots? joints not soldered? aj...
Electronics Forum | Mon Apr 14 21:43:04 EDT 2008 | joseph_gonzales16
Your problem is process you need to eliminate and there are so many causes to considered. 1.your solder paste 2.your PCB pads 3.your component 4.your profile 5.your printer 6.your placement. you need to isolate all these one of this is your problem.
Electronics Forum | Thu Aug 21 14:18:12 EDT 2008 | wrongway
yes I have seen that same problem several years ago we didn't change anything the problem went away when we used a differant date code from the same vendor I just figured it was comtaminated leads
Electronics Forum | Thu Aug 21 15:41:18 EDT 2008 | dphilbrick
We had the same problem, same brand part. We were running 3 different flavors only had the issue with one reel. Swaped out that reel for another and the problem went away.
Electronics Forum | Wed Sep 17 08:51:10 EDT 2008 | 18424
We have seen this same defect. Led's not blinking during test and some tops popping off. Ended up being an msd problem. most of the lite-on components are msl level 4-6. We now bake and track them no problems seen in a while.
Electronics Forum | Thu Apr 16 11:58:20 EDT 2009 | ccross
We have seen this exact same problem. Our vendor agreed it was their problem and also agreed it was a moisture issue within the PCB layers, not the solder mask. We have taken to baking our boards, especially when they are manufactured during the late
Electronics Forum | Tue Jan 12 02:43:20 EST 2010 | graceytiu07
To cbart, The units are from our testing center. Actually I also suspected that it is a board issue. But i dont think its possible for 2 suppliers of board to have same problem. I am also checking the possibility of problem on QFP. Thanks for the s
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC
When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re
Electronics Forum | Fri Dec 27 02:11:31 EST 2019 | anteiv
Hello, We are having problems with SMD wave soldering (ERSA) used flux is BALVER ZINN 390-RX-HT https://www.balverzinn.com/tl_files/balverzinn/downloads/intern/TDB/PDS_390-RX-HT_EN.pdf https://www.balverzinn.com/tl_files/balverzinn/downloads/datenb
