Electronics Forum | Thu Sep 06 09:49:26 EDT 2001 | ksfacinelli
This is a real problem. We have experimented with a number of off the shelf products as well as discussed the issue with a few solder manufacturers. As you are aware IPA or Flux off can make the product look worse. I would discuss with the custome
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
Electronics Forum | Fri Mar 08 11:44:00 EST 2002 | poirot
I manufacture industrial ink jet printers. I have a new application to join an unpopulated flex circuit to a light ly populated PCB. Production requirements are rather low. The area To join is 300 solder balls on the flex occupying an area of 5/8 i
Electronics Forum | Fri Apr 05 08:00:18 EST 2002 | Chris Lampron
Good Morning Everyone, It has recently come to my attention that components (PLCC's)are being placed in the sockets prior to wave soldering. Some of these components are MSD's. They have been overexposed to the atmospere, then are subjected to the w
Electronics Forum | Mon Apr 15 18:58:10 EDT 2002 | davef
Problems using NC in RF circuits are peculiar. Depending on the situation [ie, circuit layout, frequency of use, processes used, materials, and what not], a particular NC flux may not work with a RF circuit. Various NC fluxes leave different levels
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Electronics Forum | Thu Jul 25 05:56:32 EDT 2002 | ericchua
Hello, Understand you have problem of cleaning adhesives from Dek Pump Print stencil. Well, we have a cleaning machine which able to clean solder paste and adhesives. And also, we are not using any chemical but use water-base detergent. We had few c
Electronics Forum | Thu Aug 29 20:15:26 EDT 2002 | davef
That you are getting BIG gobs of solder on the pads indicates that your print / paste process is probably OK. Sounds like someone did something bad to the OSP. Tell us about: * Supplier and brand of OSP that your board fabricator used. * Number of
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