Electronics Forum | Sun Aug 19 15:34:20 EDT 2007 | davef
What are you trying to do: * Improve hole fill? * Reduce PTH voiding? Hole fill: Search the fine SMTnet Archives for stuff like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=36063 PTH voiding: Ideally, there are no voids. We're unawar
Electronics Forum | Thu Feb 21 04:41:37 EST 2008 | mun4o
hi,Toni, we use only FR4.Some of PCB we order in China and Taiwan.With these PCBs we can't any problem.Other PCB we order here in Bulgaria.The problems with voids start last year - we have voids only in PCBs from Bulgarian factory.The process is sam
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Mon Jan 17 21:01:21 EST 2000 | Dave F
Dennis: On your BGAs: * Never seen voids any place other than the top ... lower density stuff rises. * Our spec on voids says: 1 Voids 1a Voids in soldered balls shall be less than 20% of the diameter of the solder ball. 1b No void shall sho
Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams
Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark
Electronics Forum | Mon Mar 12 08:27:00 EDT 2007 | rgduval
Have you checked the parts for contamination? Are the voids out of spec? IPC allows some voiding, especially with lead free solder. Component contamination can cause this to repeat, as well. Try pre-tinning the component in question, and see if s
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Fri Mar 09 12:41:56 EST 2007 | coop
I have recently been handed over the waving operation here, and am unclear on how to address our recent issue with our Wave. We are using AIM WS-715M Flux in a Foam fluxer, and are using AIM SN-100C in the wave. The problem is on several of the assem
Electronics Forum | Mon Mar 12 13:57:50 EDT 2007 | davef
That your problem is not related to component solderability or wave process related makes us believe this has to do with bare board design. Look at how your designer did the thermal relief on the two pins that don't solder well. If you can't get a
Electronics Forum | Mon Mar 12 10:29:07 EDT 2007 | george
Are you using wave solder pallets? I use same flux and solder as you do. I've seen this problem when some walls in the wave fixture cause a "shadowing effect"...if you enlarge those openings you will increase the dwell time eliminatting voids (if the
