Electronics Forum | Mon Mar 26 07:38:26 EDT 2007 | davef
The temperature that will melt solder holding top side SMT components during wave soldering depends on the alloy of that solder. So, for example, you'd expect: * Near eutectic SnPb solder to melt around 215*C. * LF to melt around 240*C. It's common
Electronics Forum | Mon Oct 20 11:41:07 EDT 2008 | ck_the_flip
Cool name! Bong. You must be from the Philippines. The book that I grew up on as a kid right out of college who never saw a wave solder machine in his life was this one: http://www.amazon.com/Handbook-Machine-Soldering-SMT-TH/dp/0471139041 "The Han
Electronics Forum | Fri Jan 26 08:28:59 EST 2001 | Sal
I am currently in the Process of setting up some SPC software on our Wavesoldering equipment. What I would like to know for each Parameter that is listed below what kind of variation from my average setpoint would cause defects.Example. If the averag
Electronics Forum | Thu Aug 11 08:56:20 EDT 2005 | pjc
Some causes of lack of top side fillets (hole fill) are: 1. Not enough pre-heat (a top side preheat will help, if no-clean flux, be sure to follow flux mfrs specification for top side board temp just before hitting wave) 2. Not enough flux 3. Flux i
Electronics Forum | Sat May 31 09:44:56 EDT 2008 | gregoryyork
looks like the board has gone through and not actually fluxed properly,trying hand applying and it should fix it. IF it still occurs put the pallet through without pcb and without flux and see what residues come off in the wave. residues you are seei
Electronics Forum | Mon Apr 09 14:51:04 EDT 2018 | justconmac
UPDATE The reason for the board count in the wave when there are no boards is due to operators leaving racks with empty PCB slots. The input feed sensor is a little bit more in the center of the conveyor whereas the output feed is a slightly closer t
Electronics Forum | Fri Jan 06 23:06:15 EST 2006 | sumxp
Many article talk about SAC in wave soldering. Is there any possibility that eventually SAC in wave going to replace with SN100C? Anybody ever use SN100C in automotive,RFID product?
Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F
No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?
Electronics Forum | Tue Jan 12 12:51:00 EST 1999 | David
| | _|__|__|__|__|_ | | | | | | | |_ __ __ __ __ _ | | | | | | | | | | 2. Direction thru Wave ----------------
Electronics Forum | Mon Jun 14 09:16:54 EDT 1999 | C.K.
| Dear All, | | We are having a big debate over what is the industry standard in DPPM on the wave sodlering process. is a DPPM of about 800 satisfactory. As per our big bosses it should not be more than 50 DPPM. Is the figure realistic. We are ty
