Electronics Forum | Mon Aug 14 03:41:30 EDT 2017 | praveenmuthusamy
Dear ALL, what might be reasons for component drop during second side reflow soldering in PCB( OCCURS NOT FREQUENTLY- 100 BOARDS ONCE )?? your valuable comments are welcome!!!
Electronics Forum | Sat Aug 26 09:50:14 EDT 2017 | v037022
Luckly u found the root cause :) Don't you use SPI or some inspection machine? To prevent the trouble can happen next time, in my opinion, U shoud have inspection tool or Stencil design change to increase amount of solder.
Electronics Forum | Fri Aug 18 02:11:03 EDT 2017 | smeissner
pretty long video. Found this one, really short and well done: https://www.youtube.com/watch?v=v2vE-JH8pyY
Electronics Forum | Fri Sep 08 03:37:54 EDT 2017 | m_imtiaz
there any problem if Lead Free finish PCB being process using Leaded Solder Paste...? It is totally related to the manufacturing process and quality of joint, not to any specific compliance issues related to the European Union, China or any. Regards
Electronics Forum | Fri Sep 15 15:46:54 EDT 2017 | tey422
I have a customer want to add an SMD coil to the board, which they used to hand soldering all the time. I want to know is there footprint/land pattern size that I should follow? Any recommendation?
Electronics Forum | Mon Sep 25 01:42:02 EDT 2017 | bukas
hi everyone, i'm looking for someone to fabricate new or sell used wetted nozzles for Ebso SPA 250/400 soldering machine.
Electronics Forum | Tue Oct 31 17:37:09 EDT 2017 | cotinc01
Please email me at sales@cotinc.com with your requirements. We manufacture several types of selective solder nozzles for other machine types and would like to see if we can assist you with your request.
Electronics Forum | Fri Oct 13 08:09:41 EDT 2017 | davef
While I wouldn't be happy with this "Hershey's Kiss" appearing solder connection, I'd suck it up and and accept it as acceptable according to IPC-A-610F, Section 5.1
Electronics Forum | Sat Nov 11 11:11:28 EST 2017 | spoiltforchoice
One suggestion I have seen for packages like this is to have the device balled first.
Electronics Forum | Fri Dec 01 13:30:08 EST 2017 | kojotssss
Stencil thickness is 4 mil. Via's are plugging from bottom. Gas may be developed under the component? Take Reflow Ovens Thermal Profiling changes? In your opinion?
