Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy
Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both
Electronics Forum | Mon May 07 18:30:23 EDT 2001 | genny
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and
Electronics Forum | Fri May 11 15:37:58 EDT 2001 | davef
Wolfgang Tomorrow [Saturday] Lucy and I are getting-up at 6AM, shaking-off the effects of Jimbo's from the night before, grabbing the Leicas and fowl [inclement] weather gear to search for migrating warblers in what is forcasted to be a near-freezin
Electronics Forum | Fri May 18 12:21:28 EDT 2001 | camohn
When it comes to how much epoxy [aka. "glue"] to dispense to hold a IC or any part with significant mass, on the bottom of a board for wave soldering, is more better? The way I see it, one good dot should be holding such a part on the PCB. If not, th
Electronics Forum | Tue Jun 05 22:18:47 EDT 2001 | Dreamsniper
I don't understand why you wanna do this. The vendor has done this part for you and actually they have a recommended glue / solder paste life on the stencil or pcb (e.g. 6 hrs, 8 hrs.). If you will stick with their recommendations you won't be lost p
Electronics Forum | Wed Jun 13 17:15:48 EDT 2001 | medernach
Yes, I've seen it recently and it's most likely a component problem. A cap is essentially a sandwich comprised of multiple layers. the layers are either wet film or dry film. The end terminals may either be hot soldered or sputtered so there are a
Electronics Forum | Fri Jun 15 14:05:20 EDT 2001 | CPI
In response No that�s not all you need to think about, but lets look at each and then talk of others. a)The condition of the solderable surface on boards (and components) degrades over time or can be supplied in poor condition (to thin or thick HASL
Electronics Forum | Mon Jun 18 16:13:47 EDT 2001 | calipso
If a PCB is already going through ICT and some additional inspection method is desired to increase first pass test yield rates, what are the advantages/disadvantages of AOI vs XRay? The most common problems seen are missing or skewed components and i
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Tue Jun 19 13:49:08 EDT 2001 | Ben Brandt
Hello everyone. I'm trying to locate (if it exists) an impact sensor (which would activate if hit or jarred) on some sort of roll form with 2 leads which could be easily placed and soldered through automation. If anyone knows of a supplier, I would v
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