Electronics Forum: solder (Page 151 of 2099)

Re: solder balls and flux

Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann

Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t

Mixing no-clean solder with activated

Electronics Forum | Mon Jun 18 21:46:27 EDT 2001 | davef

It's possible that combining these two fluxes is benign, you sure can't say your customer is wrong, can you???? So, what is the intent of leaving these two different flux materials on your board? What is the residue remaining on your board as your

Mixing no-clean solder with activated

Electronics Forum | Wed Jun 20 11:28:45 EDT 2001 | Steve

Fluxes that have been properly heat activated are insulative (non-reactive) during operation in the field and during environmental testing. If you are also performing a cleaning operation, the possibility of growing dendrites is so remote that it can

Re: Control the solder paste

Electronics Forum | Mon Jan 10 12:00:06 EST 2000 | Dave F

First, I agree with Wolfgang, in response to Wister. Second, Wolfgang: Sometimes, our blanket purchase order for paste schedules delivery of the paste in advance of production requirements. (What!!!???? In-bound material schedules don't match out-

Thick film solder pins process

Electronics Forum | Mon Sep 16 03:10:32 EDT 2002 | stefano_bolleri

Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, ther

Labeling of SMT solder stencils

Electronics Forum | Tue Sep 14 13:40:50 EDT 2004 | paul_boxboro

I feel your pain. Your company may already be using Kapton tape labels for their board serial numbers labels. Kapton is able to withstand repeated wash and heat cycles, and can be printed on a typical Zebra printer. The key to a successful and accura

BGA relow without solder paste?

Electronics Forum | Tue Sep 20 17:15:29 EDT 2005 | valuems

Hello I'll be the one to ask a dumb question--Why not fix the screen printer? If it is a MPM you can call me and I'll help if I can. And no I'm not trying to sell any thing. Better yet --why is the printer down? Wasn't thinking that you may be ou

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 20:53:12 EST 2006 | davef

If you believe: * There is air in your paste AND * You are not whipping the air into the paste ... You should: * Return the paste to your supplier * Get it replaced * Begin qualifying a replacement supplier. One thing before you go racing off to ly

minimum solder ball (bead) size

Electronics Forum | Thu Jun 01 16:30:05 EDT 2006 | slthomas

Just wondering if anyone knows this off the top of there head. I might be able to figure out the math based on surface tension (this is 63/37 so the data is out there) but I REALLY do not want to put that kind of effort into this. :/ Editing to clar

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 15:45:18 EDT 2006 | slthomas

Yep. What I'm really looking for is the minimum radius of curvature for 63/37, which is a function of it's surface tension. It's physical properties issue, not an agency issue. I've seen some references that I have interpreted to mean that it's some


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