Electronics Forum | Mon Jun 17 21:20:48 EDT 2002 | davef
Consider slowing down the rate of heating during reflow to eliminate the ejactula. Well, if you feel this is caused by your customer�s design, it is repeatable, you think it�s coming from the reflow process, and you think your reflow process is well
Electronics Forum | Fri Jun 14 18:01:04 EDT 2002 | john_wsme
Dave and Russ, Today we modified the profile to ramp up slowly and have longer preheat time. The result is great, 0 out of 5 without bridging. I did review the FAB design and seen the pad is much biger than ball size. So I guess it is the problem.
Electronics Forum | Mon Jul 01 21:35:45 EDT 2002 | jersbo
Would rather have lower humidity and strict ESD rules in place.. than a high humidity condition anyday.. High humidity- 45RH + Paste depending on what you use may become an issue.. Components are sensitive... ever get that vacuum sealed bag you dont
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Thu Jun 20 03:29:56 EDT 2002 | Josef
I would like to ask you for help. We use mixed technology and we need to protect SMT components in double Wave. Currently we use the carrier for protection of this component. In this case this procces is not possible to use it due to gap between SMT
Electronics Forum | Mon Jun 24 19:38:52 EDT 2002 | russ
I sure hope you don't need any of those!! otherwise I don't know what I or probably most of the people reading this forum have been doing for the last 5 years. We are using a 4 zone oven (wish I had an 8 zone) and have great success putting these do
Electronics Forum | Wed Jun 26 01:08:09 EDT 2002 | ianchan
Hi Dave F, I'd hold you to that "could" opinion of yours... and I'd be most willing to give the new VP ovens a try if such ovens become commerically acceptable to the pocket and match up to our current process control requirements (that we can achie
Electronics Forum | Wed Jul 03 14:34:45 EDT 2002 | razorsek
Jeff, what I generally use as a rule of thumb on multi-row connectors was a strip on the trailing side of the connector as it flows through the wave. The strip was always the same width as the diameter of your through-hole. The distance of the stri
Electronics Forum | Wed Jun 26 12:18:40 EDT 2002 | dason_c
Steve, I suggest to review some of the paste handlering procedure from some of the supplier. Aim look have a better procedure for our industrial but you need to check with your paste requriement. ie. Indium can store the paste @25C for 3 mths??? h
Electronics Forum | Tue Jul 02 16:04:08 EDT 2002 | russ
We normally disregard what the "tech" sheets say. A lot of it has to do with your printer settings, prints per hour, placement time, stencil cleaning procedures etc... Just another wrench to throw in, We have noticed lot to lot paste differences al
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