Electronics Forum: solder (Page 1561 of 2103)

SACX vs. SN100C

Electronics Forum | Mon Jul 17 08:49:02 EDT 2006 | russ

Hi Paul, not to throw a wrench in here but I beleive that paople are talking about switching from SAC in wave to SN100C, NOT SACx, these are different. and should not be confused. SACx is supposed to fall somewhere in the middle of the SN100C and t

RoHS Conversion: Iron Tips

Electronics Forum | Mon Jul 10 12:38:19 EDT 2006 | fredericksr

Hello All, Has anyone tested the effectiveness of any process to remove lead from tinned soldering irons to RoHS acceptable levels? We have been dedicating new tips for RoHS assembly, but as our RoHS product line increases it will be important

Soldering Help

Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria

Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma

Black Island/Disco Ball Effect on BGA

Electronics Forum | Fri Jul 14 14:46:59 EDT 2006 | Gman

Hello Folks, Has anyone come across this fascinating but undesirable surface appearance of BGA balls. I am not sure what it is called but I came across the term Black Island. To me it looks more like a disco ball. Lets just say the solder ball looks

%RH in the Production Hall

Electronics Forum | Mon Jul 17 07:05:10 EDT 2006 | Steve H.

Hi, I was wondering, if there were any guidelines to what %RH the production hall should be running within, and what consequences can occurr, if we are running higher or lower than the reccommendations. I am worried, with regards to the above, as w

Solder hole found after reflow

Electronics Forum | Thu Jul 20 08:52:10 EDT 2006 | Chunks

Is there silk screen on the pads? Other than that I would look for what has recently changed. Running smooth for a year and now all the sudden a problem. New microscopes always seem to do this trick as well. Amazing all the "defects" one can fi

Low tensile strenght of SMD

Electronics Forum | Tue Jul 18 05:39:25 EDT 2006 | rocko

Hello all, After lead-free reflow process of single side assembled PCB I have a problem with a tensile strenght of SMT transformers - I can rip the parts from the board very easily. There is very good component leads wetting (optical inspection)

OSP Finish-Lead Free Solder Paste

Electronics Forum | Wed Jul 19 10:57:25 EDT 2006 | Rob

Depends on a number of things - such as type of oven, type of components, if you are washing the boards or not, etc. Assuming nothing special, no clean, I would try the following (in that order): Koki: S3X58-M406L Almit: LFM-48 Indium: 5.1 Cheers,

Tin leaching / lead terminal discoloration on Pb-free

Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org

We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 16:36:37 EDT 2006 | chrisgriffin

Thats a great idea Doc. If we all listened to your suggestions, there would be zero defects in PCB manufacturing. I bet your using Bahodum solder which, I'm sure, is incapable of defects. Pavel, sounds like you can rule out reflow as the problem.


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