Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Fri Apr 04 09:28:59 EST 2003 | davef
Q1: Anyone has any ideas on how this post-SMT reflow solder joint could have changed to whitish joint? A1: Dunno. You need to tell us more. For instance: * What is the appearance of this white residue? [eg, glassy / coarse, milky colored / opaque,
Electronics Forum | Mon Apr 28 08:52:10 EDT 2003 | davem
Chrissie, I'm glad you (and your people) made it through the painful process of reworking all those BGA's. Hope all your boards sucessfully pass test. Now on to the larger issue. In my experience, the solder paste screen printing process is (along
Electronics Forum | Wed Apr 14 20:48:43 EDT 2004 | Ken
Just a thought.... Some Fluxes require temperatures upto 260F (127C). Are you using water based flux or solvent (alcohol). I have noticed that many wave machines are NOT capable of preheating adequately when using water based materials. This can
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Mon Apr 12 09:36:57 EDT 2004 | wgaffubar
Russ, These are the pb free components that you mentioned that are coming around the bend. Not the old CBGA's. I use to use CBGA's alot with former company. These are 15 x 15 mm plastic BGA's with 14 mil pg free solder balls going on 8 mil gold pads.
Electronics Forum | Mon May 17 20:39:49 EDT 2004 | Ken
I disagree about the maintenance issues with tin/copper solder. All high tin content solders are hard on machines (silver or not). More dross? Controlling the back flow, front flow velocity and AVOID constant surface cleaning will reduce your dros
Electronics Forum | Tue Jul 13 16:19:05 EDT 2004 | Inspection Solution
Hi Mark, There are many tools available for measuring solder paste height. Most machines use laser as the basis for inspection while others use structured white light. If simple height and width inspection is all that is required, you can look int
Electronics Forum | Wed Jul 21 13:18:19 EDT 2004 | patrickbruneel
Thomas, The first thing I would suggest you to do is identify the type of problem your dealing with �pinhole� or �blowhole� before you can take the appropriate action to correct the problem. A pinhole is a void or cavity caused by non-wettable part
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