Electronics Forum | Thu Sep 16 07:07:34 EDT 2004 | C Lampron
Hello Chris, "It sticks up about 3/8" or so above the surface of the board." Is this over the ridgid portion of the PCB or in between? Is it possible to create a support fixture for printing that has relief that will allow the flex to bow downward i
Electronics Forum | Fri Sep 17 07:44:41 EDT 2004 | Simon Uk
Yes, i have used and experienced problems with step stencils, but these were mainly to do with the communication of the requirements for the suppier. Best plan is to talk to your stencil supplier and get them to make the suggestions on what works bes
Electronics Forum | Tue Sep 28 19:54:22 EDT 2004 | KEN
If we are talking about Indium...then you will eventually be paying what everyone else is. The resource is diminishing especially with the application into the display markets. Same with silver. We are comming out of an all time low for silver....
Electronics Forum | Tue Sep 28 21:46:49 EDT 2004 | grayman
yes, in the future prices of China product will increase by 10 - 20 percent, but other may increase double. So still China price will stay competative. I am not for China,in fact most of our local companies went to China already, but hey, lets face
Electronics Forum | Thu Sep 30 21:08:59 EDT 2004 | HOSS
Habba, I think I understand your question. Just to be sure.....you need to use some components that are LF in an otherwise Pb process? If this is your question, then, yes, chances are good that you will not have a problem. Of course you should do
Electronics Forum | Fri Oct 01 18:07:46 EDT 2004 | Bryan Smith
Hello Dave, Yes, this is a patented commercial process in our MEMS Foundry and we are already working with several customers. I posted my question because we only recently have started widely promoting our AuSn plating services and we're still grasp
Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
Electronics Forum | Thu Sep 30 18:23:00 EDT 2004 | russ
Comment: A 20 mil pad for a .5mm pitch BGA? That seems like an awful large pad for this device. If my math is right the pads will be basically touching each other. .5mm = .020". I would think that you have something else. You cannot have a 22mil
Electronics Forum | Mon Oct 11 15:21:20 EDT 2004 | russ
I have heard of making square apertures for round pads to aid in Xray and possibly allow for better release in some applications. The square aperture in your case would be for Xray inspection and not release. Usually a 20 mil square would be used f
Electronics Forum | Fri Oct 15 17:11:45 EDT 2004 | HOSS
Matt, Had a similar problem with HASL that wasn't fluxed properly during fab. The appearance of the HASL looked dull and/or mottled (sp?). Solder was curled under on the edges where it should have been smoothly joined to the pad. Almost like a pu
