Electronics Forum: solder (Page 1791 of 2103)

Solder Open/Mild Tombstone on 1206 LED

Electronics Forum | Thu Aug 21 14:38:32 EDT 2008 | Paul M.

I have had a similar problem as this. But, not on that particular type of component. Have your machine place the component, take the PCB over to a microscope and look at the part how it sit's on and in the paste on the pads. You might see that one

BGA Head-in-pillow Defects

Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig

Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should

Urethane Coating (1A33)

Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef

Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma

Solder not reflowing properly

Electronics Forum | Thu Aug 28 18:48:49 EDT 2008 | markhoch

You're using a SAC305 chemistry? Double check your liquidus temp! Your profile shows a liquidus temp of 217 degrees C. SAC305 is not eutectic. (It doesn't transition from paste to liquid instantly). It goes thru a "pasty" stage. We use a temp of 221

Solder not reflowing properly

Electronics Forum | Thu Aug 28 21:43:23 EDT 2008 | davef

Couple of points: * We'll tell ya, although it's tough to tell from these pix, but it does not look like dewetting. It looks like nonwetting. * We don't think you're getting this product hot enough. We don't know where you measured the profile you po

problem in solderability

Electronics Forum | Fri Aug 29 10:23:30 EDT 2008 | vladig

Everyone has been playing a guess game so far :-) but we don't even know what the lead finish is:-) Even old (Sn-Pb finish) days, the ammount of Pb in the plating would be on a single digit level (just to mitigate Sn-whiskers growth), meaning that th

problem in solderability

Electronics Forum | Wed Sep 10 14:19:51 EDT 2008 | stepheniii

Root cause analysis is simply looking for what caused a problem, then looking for what caused that, and so on, until you reach someone you don't like, or can pass the buck onto. I don't see why Vlad's method is better than tweaking your knobs until y

problem in solderability

Electronics Forum | Wed Sep 10 19:36:54 EDT 2008 | vladig

Why just a half, I'd be glad to send a whole one. Just let me knwo what you want and the phone number of the one you want to get it from. :-) The discussion was well worth it :-) On your China board "experience" I completely agree with you. It is al

Underfill 300balls BGA connector

Electronics Forum | Sun Sep 07 09:57:23 EDT 2008 | davef

We have BGA connectors on rigid laminate. Points are: * We love BGA connectors for mating mother/daughter boards because they eliminate the wave solder step required for PTH connectors. * BGA connectors are very tricky to assemble, much trickier than

power relay problems

Electronics Forum | Fri Sep 05 13:33:28 EDT 2008 | jmiller

We are having problems with relay package seals cracking and moisture intrusion in power relays on thru-hole assemblies. we use a few different brands of thru-hole relays, we are using a sn-pb process right now and just going to lead-free. the contra


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