Electronics Forum | Thu Apr 20 00:53:23 EDT 2000 | Wister
Hi,Dave The "skip" wouldn't happened because we monitor the solder paste height every two hours.The open position is between chip terminal and the solder paste.one terminal lift a little not as same as tombstone.I suspect the activity of solder paste
Electronics Forum | Wed Apr 12 15:28:46 EDT 2000 | Kevin Facinelli
I am interested in any techniques that may be utilized for bottom side soldering of Chips and Resistors on circuit cards populated on both sides containing through hole parts. Our current process is : Stencil solder paste Place a glue dot Place P
Electronics Forum | Mon Apr 10 11:56:35 EDT 2000 | Robert Hutton-Squire
Suggestions please... I have to place a number of 1206 chip resistor arrays on the bottom side of my PCB for wave soldering. The device consists of 4 x 0603 resistors in a 1206 package. The device is available with either concave or convex terminati
Electronics Forum | Thu Mar 23 22:20:51 EST 2000 | Dave F
Chris: I'm unsure about the kits you seek. Solderability of: * Components: J-STD-002, Dip And Look Method. Malcom Instruments makes a very nice tester. * Boards: IPC TM-650 2.4.12A Solderability, Edge Dip Method Good luck Dave F
Electronics Forum | Mon Mar 20 09:24:38 EST 2000 | John Sipper
1. Spec references for max allowable untinned gold near glass seal and case body? 2. Low cost mechanical dip system to facilitate tinning of DIP parts. (Low volume; currently using hand solder iron techniques to allow for max coverage without bridg
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Mon Feb 19 11:45:09 EST 2001 | sallyt
We are using a �spray� type stencil cleaner and hot DI water to clean water washable solder paste. I want to use the stencil cleaner to also clean misprinted PCBs. However, we consistently find solder balls on side A of a double-sided misprint. We
Electronics Forum | Fri Mar 02 11:13:50 EST 2001 | fkurisu
Hello Mark, To date all solder mask rework we have done has been on the PCB board. I believe that it possible to reapply solder mask on to the ball side of the BGA. Would it possible to evaluate some of your BGA's? You can contact me at 714 842
