Electronics Forum | Wed Oct 03 17:06:43 EDT 2001 | davef
Yes, moisture entrapment causes solder shorts 80% of the time. Cracks occur bottom side of the BGA. Use an acoustic microscope to find the cracks. So, what makes you think your BGA are blowing-off steam? I posted a vid on SMTnet that showed the b
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Fri Oct 12 13:40:56 EDT 2001 | Steve
I need help with a process issue. I am dealing with a board design that is double-sided SM with a couple high density through-hole devices. I want to flow solder the through-hole stuff, so what is the best way to deal with them? Since one of the thro
Electronics Forum | Fri Oct 12 14:19:03 EDT 2001 | David Brink
Steve Often solder mask is the only solution but in many cases there is enought space between smt and thru-hole to utilize a component masking wave solder pallet. The advantage to a pallet is consistancy of results and excellent protection of masked
Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef
Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th
Electronics Forum | Tue Dec 11 18:32:30 EST 2001 | edmentzer
Does anyone have experience with different colors of solder mask. I am interested to know if a clear or light color mask is better in the reflow process. Most of the boards we do have a green solder mask. It seems to me that I read somewhere that
Electronics Forum | Sat Jan 05 10:21:29 EST 2002 | Todd Murphy
Has anyone ever had any solder related problems with the Motorola 860 BGA? We are currently using the 860 on several of our products and some of the solder joints for the 860 look like crumpled aluminum foil when viewed with the Ersa Scope. Does anyo
Electronics Forum | Thu Feb 14 09:07:43 EST 2002 | PeteC
Looking at low cost reliable Mother-Daughter board interfaces. Looking at having the Mom w/ a routed out slot, like 1.7mm wide with solder lands on the bottom side then plugging in Daughter thru Mom's slot w/ the Daughter having board edge contacts t
Electronics Forum | Fri Feb 15 08:33:59 EST 2002 | fmonette
The joint IPC/JEDEC standard currently specifies a limit of one bake cycle, regardless of the temprature or duration. In the proposed revision this will be replaced by a maximum cumulative duration of 48 hours at 125C. The reason identified for thi
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
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