Electronics Forum | Thu Jan 26 02:07:33 EST 2012 | denmark
Sir i need someones expertise on my problem. We are running repair unit which we conduct FFC removal in this process we are encountering big problem by whick we lessen solder deposit on our PCB.. 1. Can you give me some idea on what way can we put a
Electronics Forum | Fri Mar 02 15:03:39 EST 2012 | davef
21. What is the recommended way to connect the sensor? Answer (Pellistors) For VQ500 series sensors please use sockets http://www.cambion.co.uk/Catalogue/Parts/1813.htm. For other pellistors connect to header legs by soldering or mechanical methods
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon
Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w
Electronics Forum | Mon May 14 13:20:22 EDT 2012 | kahrpr
first I am personally not a fan of dross reducers. We have enough issues with contaminants on boards (high impedance analog) so i do not want to introduce more contaminants into the process. Second I have not had much luck with any dross reducers. We
Electronics Forum | Wed Jul 11 22:46:32 EDT 2012 | davef
Several points are: * There can be a seasonality to the venting of [smells emanating from] wave solder machines, because the heating and cooling of your plant changes with season. * Supplier's specification for your wave solder machine defines the pr
Electronics Forum | Tue Sep 04 09:38:38 EDT 2012 | cobham1
The best thing you can do is to clean the board that has a solder paste defect on it. If you don't you probably will have issues after reflow. This could include bridging, raised parts, or any number of issues. You need to remember that if you are re
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Tue Oct 09 11:17:56 EDT 2012 | 18424
Hello All, I have PCB's in a 30 up panel that have signs of improper solder mask adhesion. Per IPC 6012 they specify a maximum of 5 Percent allowed to have problems adhering to base laminate per class 2. I am trying to figure out if this 5% is for th
Electronics Forum | Fri Oct 19 18:30:05 EDT 2012 | hegemon
When using AOI for through hole you can expect to be able to detect, depending upon whether inspecting from the solder side or the destination side: Polarity (if applies) Value (if marked) Presence (should be there) Non-Presence (should NOT be there)
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