Electronics Forum: solder (Page 741 of 2103)

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Tue Jun 08 11:54:17 EDT 1999 | Steve Skinner

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Time for the green flag to come down?

Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel

Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian

| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon

| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Re: clean glue stencil

Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F

Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv

Allmost forgot: The "black pad" is simply the oxidized Nickel.

Re: Wave Soldering

Electronics Forum | Fri Feb 25 14:47:28 EST 2000 | C.K.

Click on that link below. Sorry, I did it wrong the first time around.

Re: BGA open pin

Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean

Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po


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