Electronics Forum | Mon Oct 20 18:08:04 EDT 2008 | gregcr
Anyone have any info?
Electronics Forum | Mon Oct 20 20:46:16 EDT 2008 | davef
Why give away placement machine capacity for something that could be: * Stenciled * Hand dispensed
Electronics Forum | Thu Oct 23 08:02:27 EDT 2008 | gregcr
very good information. Thank you
Electronics Forum | Sat Oct 18 09:30:43 EDT 2008 | hussman
Sounds like a part problem. You can SOMETIMES over come this with a hotter profile. We see this a lot with brokered parts. Seems like a lot of people are rejecting parts because a lot of companies haven't perfected their RoHS process, yet produce
Electronics Forum | Wed Oct 22 00:25:25 EDT 2008 | pyrofire76
Is it possible to have OSP and after presoldering If yes, what mask used to not to affect OSP before solder?
Electronics Forum | Sun Oct 26 21:27:09 EDT 2008 | pyrofire76
pre solder means bump formation is it poassible after OSP we will do bump formation?
Electronics Forum | Thu Oct 30 12:38:11 EDT 2008 | davem
Steve, I forgot to put in the original post that the 2 friges are set on the maximum coldness settings.
Electronics Forum | Tue Nov 04 11:17:54 EST 2008 | ed_faranda
Anyone have any advise on reduing voiding in BGAs using a SAC305 solder paste?
Electronics Forum | Thu Nov 13 08:50:23 EST 2008 | evtimov
try Flux Atomization Flow - 15 CFH
Electronics Forum | Thu Dec 11 12:11:46 EST 2008 | gregoryyork
thanks for the update Hoss
