Electronics Forum: solder (Page 961 of 2103)

LED lifted soldering defect

Electronics Forum | Tue Dec 03 18:51:57 EST 2019 | kylehunter

Hi all, We are having a confusing defect with one of our client's boards. It is a large board, 30" x 12". The client supplies the LEDs, they are cheap overseas diodes, and it is not uncommon to have reels with the packaging torn. We have w

SPI

Electronics Forum | Thu Apr 28 01:40:14 EDT 2022 | sophyluo1985

Advantages of SPI 1. Reduce defects SPI was first used to reduce defects caused by improperly printed solder paste. Therefore, the primary advantage of SPI is its ability to reduce defects. Defects have always been a major problem when it comes to

Re: Dross/Oxide problems with wave soldering machine

Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F

Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form

Re: When using noclean flux or clean flux process?

Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian

| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder

Re: Solder Resist Solder balls - 'N Surface Energy

Electronics Forum | Thu Dec 24 03:49:45 EST 1998 | John Watt

| | | Folk's, | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour,

Re: Process Change

Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 14:06:16 EDT 1999 | Dave F

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 15:19:14 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Process Change

Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Curious on how this thread developed

Electronics Forum | Wed Jun 23 14:23:14 EDT 1999 | Cunli Jia

Dave, Looks like you just replied to Ryan's original question, but the message itself shows that the two of you have been going back and forth. Did you copy from your email discussion? Just curious whether something is going wrong with the Forum.


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