Electronics Forum | Fri Jun 19 19:07:07 EDT 1998 | Earl Moon
| Does anyone have wave solder experience using OSP and VOC free no clean flux? Well, Steve you back in action. Yes, it works fine. Earl Moon
Electronics Forum | Tue Jan 30 07:29:21 EST 2018 | charliedci
I believe the correct statement (I've been told) is "the process is no clean". The solder paste is "low residue". As a CM, in the past we had customers that insisted on a wash after soldering. We used DI water with a saponifier which had mixed result
Electronics Forum | Wed Jan 31 07:37:48 EST 2018 | stephendo
Michael What you say is not a reason for washing. It is a reason to not use Can't Clean solder paste. Although I guess if they use the real name they wouldn't sell as much as they do by calling it No Clean.
Electronics Forum | Fri Jan 26 12:19:24 EST 2018 | clockwatcher
I'm looking for a No Clean SAC 305 Solder Paste that can be run through our inline wash. No chemicals just DI water.
Electronics Forum | Thu Feb 01 08:46:54 EST 2018 | charliedci
Your right, he is "selling it". Or I should say he is not selling no-clean solder paste.
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1
Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M
Electronics Forum | Tue Jun 04 13:13:58 EDT 2002 | slthomas
Another thing we see is solder balls (sometimes fines, sometimes larger stuff) in the vias after a misprint has been poorly cleaned, as in wiped down but not washed. They end up in the plated through holes too, but those get nicely cleaned up in the
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Wed Jun 05 12:22:45 EDT 2002 | Bob
No. Placement force is fine. Also boards have been inspected prior to reflow using microscope with no evidance of misplaced solder balls. The ramp rate has been reduced to acceptable limits, typically .8 - 1.5 degrees per sec. Outgassing from eithe
