Electronics Forum | Thu Jul 28 07:23:24 EDT 2011 | scottp
My group supports a couple hundred lines all over the world. Most of them use squeegees but a few use either the MPM Rheometric pump heads or the DEK Proflow heads. I absolutely hate the enclosed heads. Flux separation, compaction, and the print q
Electronics Forum | Fri Jan 30 15:11:50 EST 2009 | joseluis_amper
Dear Sir. Recently we had a problem in our production. We had pcbs with no RoHs (with solder Pb in pads) but we used paste Lead Free. I want to know if we will have problems in this solders in the future, because (perhaps)the solder will be broken, o
Electronics Forum | Tue Feb 03 03:35:30 EST 2009 | sachu_70
Hi Jose, such a process is possible, but you need to confirm that the PCB material has high Tg. In additon, you need to re-look solder paste printing parameters and make required changes in stencil apperture design for optimum solder volume. Just a
Electronics Forum | Sun Feb 01 07:50:07 EST 2009 | davef
The concern about lead contamination of lead-free solder has to with zone refining. For more, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30315
Electronics Forum | Fri Jan 30 18:24:09 EST 2009 | gsala
Buenas dias Jos�, It shoul not be a problem. We had situation like that when in the early 2006 the Lead Free fase in Pb fase out, no pbm on solder joints. Today, after about 3 years, those cards are stil working in the field without any defect. Reg
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron
Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled
Electronics Forum | Mon Mar 27 15:10:48 EST 2006 | ms
Hi Steve Thanks for your reply. Your comments make it sound like it may be the nature of this paste. Any one else agree? Paste control is fairly good. Paste is put in fridge straight after it arrives at inwards goods, (4deg). Removed from fridge
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
