Electronics Forum | Fri Dec 27 01:26:08 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Wed Oct 03 12:02:04 EDT 2001 | kjwaskow
We are getting solder blobs forming in open areas of the BGA, between the center array and outer array. THe ceter array balls are starved of solder, so they are presumably the source. The theory we hold is possible moisture causing the solder to mo
Electronics Forum | Wed Oct 03 17:06:43 EDT 2001 | davef
Yes, moisture entrapment causes solder shorts 80% of the time. Cracks occur bottom side of the BGA. Use an acoustic microscope to find the cracks. So, what makes you think your BGA are blowing-off steam? I posted a vid on SMTnet that showed the b
Electronics Forum | Wed Oct 23 14:33:44 EDT 2002 | lhoang
Any one encountered the problem such as poor conductivity when the silkscreen mis-registrated on the solder pads ? Thanks; Linh
Electronics Forum | Sun Nov 03 08:28:29 EST 2002 | davef
We have had poor solderability from silk screen being on pads, but have never measured the conductivity.
Electronics Forum | Tue Dec 05 22:27:05 EST 2023 | padawanlinuxero
Hello, I am experiencing issues with one of my PCB suppliers. Specifically, I am having trouble with solder shorts occurring on a SOIC8 component, and always in the same pads. Upon inspection with a microscope, I discovered that three of the pads ar
Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.
One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the
Electronics Forum | Tue Jul 06 18:16:14 EDT 1999 | Boca
| | Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area.
Electronics Forum | Thu Sep 18 15:29:59 EDT 2003 | Gabriele
Hi all, by reading along those thread (SOT23) and Tan outgassing I learned plenty of things. My first time approacing this kind of Q$A Forum, very intesting tech communication way. Any way, the path of magnetism effect was chosen when time ago we met
Electronics Forum | Wed Oct 07 17:36:48 EDT 1998 | Ted Nicholas
Hello! Does any one know of a disadvantage of using the Phillips recommended wave solder SOIC footprint where the last pad on each side of the SOIC is enlarged, instead of placing an extra pair of pads behind the SOIC. Both footprint patterns seem e
