Electronics Forum | Wed Jun 20 15:09:33 EDT 2007 | realchunks
Hi D, 99% of the time we get brokered parts, the big problem is co-planerity. Havn't seen a solderablity issue yet, but.... For solderability I guess it would depend on the part. 30 pieces is the general rule for SPC, so maybe start there? We ge
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Mon Oct 12 01:17:00 EDT 2020 | SMTA-64386317
Hi, I am facing high fall out of microphone low sensitivity issues. This microphone is soldering thru SMT soldering with low peak temperature profile which peak at 232 DegC to 240 DegC and have skipped X-Ray inspection but still seeing fall out espec
Electronics Forum | Fri Feb 22 18:36:36 EST 2013 | austinpeterman
Has anyone experienced bridging on topside (solder destination side) surface mount devices after wave soldering? We x-rayed 100% of the placements after smt re-flow with no issues. When the same placements were x-rayed after the tht wave solder pro
Electronics Forum | Wed Oct 04 16:19:54 EDT 2006 | russ
you may want to try a different MFGR of paste, this does help on many occasions. Russ
Electronics Forum | Wed Oct 04 16:47:25 EDT 2006 | russ
very minimal at very few locations. We do not Xray every board but sample them. I think you will find pretty good results here (not perfect) Russ
Electronics Forum | Thu Oct 05 07:58:05 EDT 2006 | realchunks
I have noticed certain BGAs void more than others. We place about 8 different brands of BGAs and only one brand voids like crazy and we have to adjust for it.
Electronics Forum | Thu Oct 05 16:06:33 EDT 2006 | cw
Thanks! What's your ramp rate?2 - 3C/sec? What's your time above 217C. What's your peak temp?
Electronics Forum | Fri Oct 06 08:24:01 EDT 2006 | inds
CW, make sure your customer is aware of the affect high temp might have on adjacent components on the board. I guess you must have already checked out the rated temperature of all the components on the board
Electronics Forum | Mon Aug 13 08:16:19 EDT 2007 | davef
Your theory is reasonable about a component issue. You need to investigate the solderability of the pads on the BGA interposer.
