Electronics Forum | Tue Mar 23 04:07:44 EST 1999 | Scott Davies
Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots to selected
Electronics Forum | Sat Mar 20 09:02:47 EST 1999 | John W
John, SOT 23's on the bottom side is no real problem...as long as you get the orientaion to the wave right and you remember to increase the pad sizees to allow the solder to get to the pads. Soldering with only one wave would be trick as Vinesh sugg
Electronics Forum | Sat Mar 20 14:48:47 EST 1999 | John
Thanks guys, since I have no control as to who makes the board (probably the lowest bidder), I guess I'll keep the SOT's on top. Thanks for your help, John | John, | | SOT 23's on the bottom side is no real problem...as long as you get the orientai
Electronics Forum | Wed Mar 17 17:14:49 EST 1999 | Michael Allen
Another test to consider is dye penetrant analysis. The technique involves flooding the area beneath the soldered part with dye (preferably a bright color, like red). After drying the board+dye in an oven, you peel or torque the part off and inspec
Electronics Forum | Thu Mar 04 14:33:09 EST 1999 | Greg Valdman
Our vendor proposed to supply us with shields made out of Cold Rolled Steel (CRS) electroplated with Sn (50 - 150 minches). Should I be concerned with solderability or are there a better alternatives to tin finish?
Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook
| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just
Electronics Forum | Mon Mar 01 13:29:43 EST 1999 | dszeto
We have customer requested machine dispension on adhesive of solder side components, however we are currently using stencil printing for adhesive. Have anyone evaluated and compared on dispension and screen printing of adhesive before? Thanks!
Electronics Forum | Tue Feb 23 16:05:46 EST 1999 | Randy Haller
| What to look for that causes tombstoning and the corective action. | 1:check reflow profile 2:reduce pad size 3:reduce deposition of paste(stencil thickness/opening of aperatures) 4:Check components for solderability Good Luck
Electronics Forum | Mon Feb 22 14:02:17 EST 1999 | Michael Allen
We have resorted to adding a ring (or donut) around our 0.040" round fiducials. The donut acts as a "plating thief" to minimize the thickness of the copper plating (in the case of HASL finish) and of the solder plating (in the case of solder-plated
Electronics Forum | Wed Feb 17 16:39:05 EST 1999 | 3D
What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.
.gif)
.gif)
